IC/TO Package line

Automatic wire wedge bonder

MD-Etech1850
Product description: Automatic wire wedge bonder MD-Etech1850
INQUIRY

MD-ETECH1850 automatic ultrasonic wedge bonder using servo system, 4"*4" working stroke, can suitable for diversification LED products. Sealed clean ultra-silent working table provides a good working environment. With technical innovation, precision and capacity are improved obviously. The high technology, high precision, high accuracy pointing system can offer a more excellent production scheme with good capacity and quality. Operate with Chinese and English menu, friendly user interface.

1.Specification

Bonding Head and Table
XY travel	4"4"(LED); 3"3"(COB)
0	±360°
Z travel	0.4"
Resolution	0.02mil
Bond angle	30°
Wire size	0.7mil~2.0mil
Bond force	15~200gm(adjustable)
Bond power	0~2Watt(adjustable)
Bond head clearance	4.8mm
F/T resolution	Adjustable
Bonding through put	UPH 10k(LED) 8wire/sec(COB, based on 2mm wire length)
Transducer and Power Unit
Transducer	Aluminum alloy light weight type
Power generator	Auto-cal ultrasonic generator
Alignment Reference
Die	0, 1 or 2 points
Substrate	0, 1 or 2 points
Image Recognition System
XY	±1mm(3.5 times amplification)
0	±15°
Accuracy	±1/4 pixel
Recognition time	120ms
Optic
Microscope	10~30 times, dual FOV zoom
Power Supply
Voltage	AC110V/220V
Frequency	50/60HZ
Power consumption	800W(Max)
Program Storage Capacity
Number of program	Practically unlimited
Number of chips	1000chips/program
Number of wire	1000wire/chip
Dimensions and Weight
Weight	280kg
Size	750(D)1050(W)1450(H)mm