语言选择：
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SEMIAUTO SUBSTRATE LAPPING/POLISHING MACHINE |
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應用場景 Machine Application |
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Sort by Process Material |
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Sort by Application |
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金屬和合金Metal & Alloy 工業陶瓷 Ceramic 氧化物質 Oxide 碳化物質 Carbide 玻璃 Glass 塑膠 Plastic |
半導體 Semi Conductor |
LED substrate 晶元襯底Si, SiC, Ge, Ge-Si, GaN, GaAs, GaAsAl, GaAsP, InSb, InP, ZnO, AlN, Al2O3, etc. |
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塑膠Resin |
PE、E/VAC、SBS、SBR、NBR、SR、BR、PR |
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PCB |
背膠、塗層、電路 adhensive,coating,circuit |
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光學件Optical |
光學鏡片、閃爍晶體、全息投影玻璃、HUD玻璃optical lens,HUD glass, screen glass |
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雷達 Radar Gemstaone Others |
氧化皮板 Oxide coating plate Jade,sapphire,agate etc Valve sealing ring. Micrometer Diamond,bearing,etc |
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Lapping can only remove slight thickness of object.if thining margin>=100um, thinner machine are needed.(contact us for thinner) |
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設備參數 Machine Specification |
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常規參數 Standard Specification |
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Machine Series |
MDS8104LMFR |
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Plate diameter |
Φ810mm |
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Max. Object Diameter |
Φ350 mm |
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Number of station |
4 |
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Plate Rotate Speed |
0-90 RPM |
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Cylinder Bar Rotate Speed |
0-40 RPM |
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Facing & Grooving Speed Not include in Polishing |
0-120mm/m |
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Total weight |
2200kg |
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Floor space |
2200*1200mm |
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选配 Optional Choice |
参数 Specification |
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Controls |
Digital / Touch-screen PLC |
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Pressure Source |
Integrated with PLC |
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Facing & Grooving system |
Digital / Manual control feeding depth integrated with PLC / PLC control feeding depth integrated with PLC |
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Plate cooling system |
Integrated in Machine |
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Slurry supply system |
Digital / integrated with PLC |
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Cylinder Bar Drive System |
Integrated with PLC |
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Dust Vacuum system |
Manual / Integrated with PLC |
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1,Sample making based on production requirement can confirm the necessity of optional kits. 2,The shaded options is buit in this machine. 3,Facing and Grooving system is unnecessary for polishing machine and not configured. 4,Substrate Lapping/Polishing machine is highly configured, A dust-proof shelter is utilized for protection from fugitive or solid particle scraping against object’s surface while processing, especially when polishing. 5,Contact us for more type of lapping/polishing machine |
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联系人：胡顺语
手机：18998467552
电话：020-84789496
邮箱：shunyu@minderpack.com
地址： 广东省广州市番禺区大龙街市新路新水坑段43号813
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minderpack