IC/TO Package line

语言选择：

IC/TO Package line

Bond pull tester MFM1200

Manual Epoxy die bonder

Manual Epoxy and Eutectic Die Bonder

Automatic die bonder manual upload and down load

Automatic die bonder automatic upload and download

High precision die bonder MD-1412

Reel feeder type die bonder

High precision die attach machine

Automatic wire ball bonder

MD-S series automatic semiconductor wire ball bonder

TO220 Die Attach Machine

TO220 Wire Bonder

Automatic wire wedge bonder

Automatic dispenser MD-910

MDCOB501 Automatic COB Smart Glue Dispenser/Sealer

MDDB550 Full-automatic COB Smart Die Bonder

Semi-automatic taping machine for ICs

SOP SOT DIP TO Package Autoloader

SOP SOT DIP TO molding machine

SOP SOT DIP TO Degate and trimming system

SOP SOT DIP TO Laser marking system

SOP SOT DIP TO Form and singulation system

MDRBDB06-0203-10 Automatic dispensing and placement machine

栏目导航

新闻中心

May 1, International Labour Day notice2021-04-17

联系我们

CONTACT US

联系人：胡顺语

手机：18998467552

电话：020-84789496

邮箱：shunyu@minderpack.com

地址：广东省广州市番禺区大龙街市新路新水坑段43号813

QQ在线客服

sales

SKYPE在线客服

service

点击联系我

minderpack

关闭