IC/TO Package line
MDRBDB06-0203-10 Automatic dispensing and placement machine
- 产品描述： MDRBDB06-0203-10 Automatic dispensing and placement machine
-
Dimension：
X 1600mm
Y 1300mm
Z 1700mm
一、Equipment structure
Include：
1、Glue tray
2、Dispensing robot arm
3、Surveillance camera
4、Base positioning CCD1
5、Chip patch robot
6、Chip front calibration CCD2
7、Chip picking robot
8、Chip wafer CCD3
9、Chip wafer（TRAY）
assembly
10、Thimble assembly
11、Chip calibration workbench
12、Base fixture table
二、Device principle function
MDRBDB06-0203-10 is a production equipment for bonding substrates and chips to a COB/COC process through a dispensing process.
Manual loading section：
The substrate is manually placed on the substrate fixture, and the substrate fixture is placed on the substrate table to be fixed.；
Automatic patch section：After the device is started, the substrate table moves, and the substrate is moved under the CCD1. After the camera is recognized, the system feeds back the information, and the substrate table performs position compensation, which is the accurate position of the substrate；The dispensing manipulator dips glue on the glue tray, then moves over the base and carries out dispensing, then leaves and dips glue to prepare for the next dispensing action；At the same time of dispensing, the chip picking robot picks up a chip on the chip wafer and places it on the nozzle of the calibration workbench，After the CCD2 is recognized, the calibration workbench performs position compensation in the XY and Ɵ directions. The chip placement robot accurately picks up the chip and moves it to the substrate. The chip is applied with a certain pressure to make the chip and the substrate firm. Contact and locate。After the completion of the solid crystal, the apparatus performs the next cycle until the patch solid crystal process of the plurality of substrates of the entire substrate fixture is completed.
三、Overview of major components
Robot and dispensing system
The robot can achieve precise displacement in the three directions of X, Y and Z.
The nozzle of the robot adopts the bakelite nozzle to avoid damage to the wafer, and the base nozzle can realize the rotational positioning. The pressure of the nozzle nozzle is controlled in the range of 10g to 50g.
The dispensing system uses a dispensing structure similar to ASM, which allows for a good control of dispensing.
Overview of major components
Chip wafer（tray）assembly
It contains crystal ring fixer,
thimble assembly,
XY worktable.
Overview of major components
Robot Arm
It can realize XYZ three-axis linkage,
the nozzle has a buffer function,
and realizes mechanical pressure control,
the pressure range is 10~50 grams.
Vacuum and blow control.
Overview of major components
Chip calibration workbench
It can realize XYZ three-axis linkage,
and has a chip adjustment mechanical
mechanism to ensure the imaging of
the chip, which is convenient for the
CCD system to identify and locate,
and a chip recycling device is
also arranged at the edge.
Base table
With XY platform structure,
table travel range: X200,Y300。
The base fixture is easy to assemble.
CD vision system
The equipment uses industrial cameras
to identify and locate products to improve
the packaging accuracy of the products.
A total of 6 sets of vision components are
used, each of which includes industrial
cameras, lenses, and LED light sources.
Dispensing system
Rotating glue tray, flat scraper to maintain
the amount of glue. The amount of dispensing
is controlled by adjusting the thickness of the
scraper；
The dispensing head assembly is placed on Dispensing head assembly
the X, Y, Z working arms for easy position
setting.
四、Device parameters
Dimension：1600x1300x1700(mm)
Weight：1200KG
Power：8KW
Air pressure：0.4～0.6MP
Voltage：220W
Positioning accuracy：±10µm
Angle accuracy： ±1°
UPH:2000/H
Solid crystal pressure：10～50g
Wafer size：6"(tray 2"X2")
Base table travel size：X200-Y300
Chip size：0.2～1mm
service
minderpack