语言选择：
MDSJHYZPGJ0225 Epoxy and Eutectic Die Bonder
1. Effective solution without touching the surface of the chip Clamp edge collapse problem
2. Automatic scribing, dispensing, sticking, automatic rebound height detection
3. The chip friction range is adjustable, the solder overflows evenly, and the void rate is small.
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Screen: |
Industrial computer touch screen |
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Chinese and English interface |
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SMD method: |
Vacuum adsorption, clip clamping, |
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Eutectic Chip Size: |
≤8mm |
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Bonded Chip Size: |
0.2-25mm |
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Minimum component size: |
150*150μm |
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Friction direction: |
X&Y bidirectional |
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Friction Amplitude: |
20-500um |
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Adhesive pressure: |
10-150g |
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Chip suction nozzle: |
360°rotatable |
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Fine mobile X&Y&Z platform: |
50*50*50，Resolution 0.2μm |
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vacuum tool holder , With nitrogen protection (optional pulse heating system) |
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1.compatibility
*Adapt to multi-sized chips without custom nozzles
*Adapt to all kinds of solder epoxy patch & eutectic patch
2.safety
*Accurate positioning with automatic height detection
*Program-controlled clip opening and closing does not damage the chip
*Clamping force is stable
3.stability
*Servo motor drive for smooth operation
*The integrated electronic control system has a low failure rate
*Industrial Panel PC
4.adaptability
*Optional pulse heating method, fast heating and cooling speed
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Parameters |
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power supply: |
AC220V±10%，50-60HZ，≤400W |
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Compressed air>=0.5MPa |
Vacuum pipeline <-0.08MPa |
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External dimensions: |
800*380*450mm |
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weight: |
80KG |
联系人：胡顺语
手机：18998467552
电话：020-84789496
邮箱：shunyu@minderpack.com
地址： 广东省广州市番禺区大龙街市新路新水坑段43号813
service
minderpack