High precision die attach machine

Work flow:

3).description:

3.1 LF station

3.1.1 magazine upload；

3.1.2 magazine exchange without stop；

3.1.3 magazine contain quantity: 3pcs；

3.2 LF dispensing station

Optional sringe dispenser and stamping dispensing；

3.3 Swing arm die picking up station1

3.3.1 rotary use high torch 2000w servo motor control, 180degree swing,can adjust sucker pressure

3.3.2 die placement accuracy:<±25um>；

3.3.3 die placement angle accurcy:<±3o >；

3.3.4 die missing check。

3.4 wafer atation1

3.4.1 with 12inch wafer station acceptable 8inch；

3.4.2 wafer auto-expanding function；

3.4.3 CCD system check and position wafer；

3.4.4 automatic adjust the wafer anlge.。

3.5 correcting station

3.5.1 use linear motor and high precision grating to insure the accuracy.

3.5.2 rotary use 5 phase motor control

3.6 linear die picking up station 2

3.6.1 linear method pick and place die, pressure adjustable.

3.6.2 die placement accuracy:<±15um~±25um>；

3.6.3 die angle accuracy:<±1o >；

3.6.4 die missing check。

3.7 receipt

3.7.1 stackable magazine receiption；

3.7.2 non-stoping when receition

4）basic funtion：

4.4.1 system: Windows 7

4.4.2 interface：chinese & english

4.4.3 cycle time：720ms(Max)   UPH≥5K

4.4.4 whole position accuracy：±15um~±25um

4.4.5 whole angle position：±1°

4.4.6 die size：1mm*1mm～10mm*10mm

4.4.7 LF size：length≤260mm  width≤80mm

4.4.8 power：220V±10V，50HZ  700W

4.4.9 air（pressure）：5～6Kgf/cm 2

5）funtion:

5.5.1 die missing checking fuction

5.5.2 no limit program number stortage

5.5.3 external UPS system

5.5.4 internal vaccum pump

5.5.5 with Mapping function

5.5.6 die bonding quality check

5.5.7 reverse check function

5.5.8 size and weight：

5.5.8.1 LWH:2200mm*1400mm*1600mm （）

5.5.8.2 Weight：1500Kg

6）die picking up station：

6.6.1 pick up tool：surface picking up

6.6.2 swing arm：180°rotoray

6.6.3 picking up pressure：20g～200g

7）die bonding station：

7.7.1 head：rotary，surface mounter

7.7.2 die attach side：linear moving

7.7.3 die attach pressure：20g～200g

7.7.4 wafer station：

7.7.5 max stroke:12” × 12” (325 mm × 325mm)

7.7.6 repeat accuracy：±2um

7.7.7 ejector stroke: 3mm (Max)

8）linear die bonding system：

8.8.1repeat accuracy：±2um

9）dispensing system:

9.9.1 dual dispensing system

10）upload and download system

10.10.1magazine

10.10.2 max lead frame size：80 mm ×260mm