Horizontal back grinder

Application:

suitable for high hardness,thin,and high precision product. like LED sapphire substrate,quartz crystal,silicon wafer,ceramic,wolfram plate, germanium plate thinning(grinding)

Principle:

This machine is automatic precision grinding machine,the sucker/chuck(either vacuum type or electromagnetism type) suck the wafer and rotary opposite from the grinding wheel,the grinding wheel feeding by driving system. this method has low drag force,will not broke the wafer,and high productivity.

This machine can auto aiming the tool, actually test the grinding torque,automatic adjust the grinding speed, so to avoid broking the wafer.

1,Can grind the wafer to 80um, and the planeness and parallelism can be +-0.002mm.

2,High speed, LED sapphire substrate can be 48um/minute, silicon wafer can be 250um/minute.

Specification: