Vertical grinder

Application:

mainly used at silicon wafer, ceramic,glass,quartz crystal,sapphire,semiconductors precision thinning(grinding) 。

it is made from sucker, sucker main axis,grinding wheel, grinding wheel main axis,and driving part and guide screw etc.

Sucker: can be chosen to electromagnetism sucker or vacuum sucker,sucker diameter can be 320mm-600mm.

Sucker main axis driving method is frequency control of motor speed, anti-clockwise rotary,speed 3-140 adjustable.

Grinding wheel:the diameter of grinding wheel is depend on the diameter of sucker, have 150/170/210/300mm type. the granularity(roughness) of the grinding wheel is depend on the process.

Grinding wheel main axis:frequency control of motor speed, 3000-8000 adjustable.

Guide screw feeding part:high precision guide screw feeding part, serve driving, 0.001-5mm/min adjustable,it is checked by grating ruler.

this machine is very easy for operator.

Specification: