MDDB550 Full-automatic COB Smart Die Bonder

Equipment features

1. double-camera full-alignment recognition and positioning system pioneered by the Eagle-eye and the double die bond platform can realize continuous-cycled and uninterrupted operations. The products can be arranged and mounted at will.

2. Double solid die bond mode, which can mount different kinds of IC at the same time. Up to 8 boxes can be mounted at the same time.

3. It has automatic angle correction function and its IC can be mounted at 360 degrees, which can ensure better die bond effect.

4. Customized smart die bond mode can simultaneously solidify multi-chip boards of various PCB boards and smartly identify bad products;

5. Dispensing is done before die bond, which can integrate dispensing and die bond into one.

6. Under the compatible mechanical positioning mode with fixture positioning function, products with components on the back or products not suitable for aluminum disc operation can be mounted;

7. All-english operation interface, fully computerized input parameters and control mode  are easy to operate and understand;