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Plasma surface treatment machine and contact angle tester

  • SPMV-100HT Vacuum microwave plasma cleaning machine
  • SPMV-100HT Vacuum microwave plasma cleaning machine
  • SPMV-100HT Vacuum microwave plasma cleaning machine
SPMV-100HT Vacuum microwave plasma cleaning machineSPMV-100HT Vacuum microwave plasma cleaning machineSPMV-100HT Vacuum microwave plasma cleaning machine

SPMV-100HT Vacuum microwave plasma cleaning machine

  • SPMV-100HT
  • Product description: Vacuum microwave plasma cleaning machine
  • INQUIRY

SPMV-100HT Vacuum microwave plasma cleaning machine

1、Summary
1.1 Summary
Microwave plasma cleaning machine, SPMV-100H is a low-pressure microwave plasma cleaning system, which is used for surface pretreatment before SMT, wire bonding, packaging and other processes. The freely moving electrons generate Plasma and enter the magazine where the cavity is located for process cleaning. A large amount of sustained plasma can be generated by applying microwaves at a frequency of 2.45 GHz to a window in the wall of the vacuum cavity. The cavity is suitable for different size cartridges. SPMV-100H can provide fast non-destructive plasma cleaning effect. The plasma cleaning effect of the system is achieved by the generation of activated free radicals through the cartridge.

1.2 Features
The product placement fixture is flexible and can adapt to irregular products
Electrodeless microwave design can meet the processing needs of soft products.
No UV radiation
Low temperature plasma to avoid thermal damage to the product
Electrically neutral plasma, no electrical damage to products
Equipped with magnetic fluid rotating frame to increase the uniformity of Plasma treatment
Efficient and uniform microwave plasma output to ensure etching efficiency

1.3 Industry application
PCB/FPC industry: hole drilling and surface cleaning, coverlay surface roughening and cleaning
Semiconductor industry: semiconductor packaging, camera modules, LED packaging, BGA packaging, Wire Bond pretreatment
Ceramic: packaging, pre-dispensing treatment
Surface roughening etching: PI surface roughening, PPS etching, semiconductor silicon wafer PN junction removal, ITO film etchingPlastic materials: Teflon Teflon surface activation, ABS surface activation, and other plastic materials cleaning activation
Surface cleaning before ITO coating

2、Technical Parameter

2.1 Equipment Specification