MDHYDS12FA 12 inch discing saw for semiconductor industry

MDHYDS8FA

MDHYDS12B

MDHYDS12FA

Multi plate dicing

√

√

√

Auto focus

√

√

√

Auto align

√

√

√

Shape recognition

*

*

*

Dicing mark check

*

*

*

Non contact height test

√

√

√

Blade broken check

*

*

*

Dual camera align system

√

√

√

MDHYDS8FA

MDHYDS12B

MDHYDS12FA

Spec

dicing size

mm

ф8”〡□250

ф12”〡□300

ф420”〡□360

ф12”〡□275

dicing depth

mm

≤4mm or custom

≤4mm or custom

≤4mm or custom

Main spindle

rotaty speed

minˉ¹

6000∽60000

6000∽60000

6000∽60000

power

kW

DC,2.4at60000minˉ¹

DC,2.4at60000minˉ¹

DC,2.4at60000minˉ¹

X axis

stroke

mm

260

310

450

310

speed range

mm/s

0.1∽600

0.1∽800

0.1∽1000

Y axis

stroke

mm

260

170

310

resolution

mm

0.0001

310

450

0.0001

single move accuracy

mm

≤0.002/5

≤0.002/5

≤0.002/5

F accuracy

mm

≤0.005/260

≤0.005/310

≤0.005/310

Z axis

stroke

mm

40

40

40

max blade size:

mm

ф58

ф58

ф58

resolution

mm

0.00005

0.00005

0.00005

accuracy

mm

0.001

0.001

0.001

R axis

rotary range

deg

380

380

380

Basic required

power

KVA

4.0（three phase，AC380V）

5.0（three phase，AC380V）

7.0（three phase，AC380V）

air

Mpa L/min

0.5∽0.6max consumption260

0.5∽0.6max consumption400

0.5∽0.6max consumption550

cutting fluid

Mpa L/min

0.2∽0.3max consumption4.0

0.2∽0.3max consumption7.0

0.2∽0.3max consumption9.0

cooling water

Mpa L/min

0.2∽0.3max consumption1.5

0.2∽0.3max consumption3.0

0.2∽0.3max consumption3.0

exhaust

m³/min

5.0

8.0

8.0

size

mm

900*1050*1800

1170*1030*1850

1380*1300*1850

1200*1600*1800

weight

kg

1050

1400

1550

2000