Language: Chineseline English

Semiconductor industry

  • Semi auto CMP system for semiconductor
Semi auto CMP system for semiconductor

Semi auto CMP system for semiconductor

  • MDS8104LMFR
  • MDS8104PMFR
  • Product description: CMP system
  • INQUIRY

MDS8104LMFR/MDS8104PMFR

SEMIAUTO SUBSTRATE LAPPING/POLISHING MACHINE

應用場景 Machine Application

據材料分類

Sort by Process Material

據應用分類

Sort by Application

金屬和合金Metal & Alloy

工業陶瓷 Ceramic

氧化物質 Oxide

碳化物質 Carbide

玻璃 Glass

塑膠 Plastic

半導體

Semi Conductor

LED substrate

晶元襯底Si, SiC, Ge, Ge-Si, GaN, GaAs, GaAsAl, GaAsP, InSb, InP, ZnO, AlN, Al2O3, etc.

塑膠Resin

PE、E/VAC、SBS、SBR、NBR、SR、BR、PR

PCB

背膠、塗層、電路 adhensive,coating,circuit

光學件Optical

光學鏡片、閃爍晶體、全息投影玻璃、HUD玻璃optical lens,HUD glass, screen glass

雷達 Radar

Gemstaone

Others

氧化皮板 Oxide coating plate

Jade,sapphire,agate etc

Valve sealing ring. Micrometer Diamond,bearing,etc

Lapping can only remove slight thickness of object.if thining margin>=100um, thinner machine are needed.(contact us for thinner)

設備參數 Machine Specification

常規參數 Standard Specification

Machine Series

MDS8104LMFR

Plate diameter

Φ810mm

Max. Object Diameter

Φ350 mm

Number of station

4

Plate Rotate Speed

0-90 RPM

Cylinder Bar Rotate Speed

0-40 RPM

Facing & Grooving Speed

Not include in Polishing

0-120mm/m

Total weight

2200kg

Floor space

2200*1200mm

选配 Optional Choice

参数 Specification

Controls

Digital / Touch-screen PLC

Pressure Source

Integrated with PLC

Facing & Grooving system

Digital / Manual control feeding depth integrated with PLC /

PLC control feeding depth integrated with PLC

Plate cooling system

Integrated in Machine

Slurry supply system

Digital / integrated with PLC

Cylinder Bar Drive System

Integrated with PLC

Dust Vacuum system

Manual / Integrated with PLC

1,Sample making based on production requirement can confirm the necessity of optional kits.

2,The shaded options is buit in this machine.

3,Facing and Grooving system is unnecessary for polishing machine and not configured.

4,Substrate Lapping/Polishing machine is highly configured, A dust-proof shelter is utilized for protection from fugitive or solid particle scraping against object’s surface while processing, especially when polishing.

5,Contact us for more type of lapping/polishing machine