Application:
Special for deep access bonding design in wire bonding. Reach depth about 20mm pending.
Specification:
1,electric requirement:220VAC±10%、50HZ、60W be sure connected to ground
2,wire diameter:25~50µm
3,ultrasonic power:0-3W, 60kHz, two channel. can be set separately of the two point
4,bond time:5-200ms,two channel
5,bond force:10-60g,two channel
6, span between first bond to second bond by automatic mode:0-10mm(motorized)
7,bond radian: 0-6mm(motorized)
8, jig moving area: Φ16mm
9,mouse hand:20*20mm
10,digital camera: optional
11,dimension:600*560*390mm weight:36kg
联系人:胡顺语
手机:18998467552
电话:020-84789496
邮箱:shunyu@minderpack.com
地址: 广东省广州市番禺区大龙街市新路新水坑段43号813