ID wafer Slicer MD-45S153B

Designed for automatically slicing semiconductor material, glass, ceramic, lithium tantalite and lithium columbate and other hard or fragile materials.

Main Features Spindle unit： It adopts vertical spindle design. It uses radial ball bearing to increase the rigidity, precision and life. Its vibration is small. Worktable unit Worktable use high precision linear guideway an AC servo system. The range of speed is wide and the low speed performance is better. It can satisfy requirements of different materials. Feeding unit Feeding system uses step motor and driving system to improve stability and precision.

MD-45S153B

Maximal Diameter of Cutting Ingot: ￠153mm

Blade Standard:￠690mm×￠241mm×0.15mm or ￠690mm× ￠235mm×0.15mm

Maximal Length of Cutting Ingot:400mm

Cutting speed:0.2〜99mm/min □Return Speed:1〜1000mm/min

The speed of main spindle:1420r/min

Stepping deviation of feeding :±0.005mm(testing with l mm feeding step)

Range of Wafer Thickness:0.001〜68.00mm

Adjustment only of Crystal Direction:0.001mm

Adjustment of Crystal Direction: Horizontal range（x）±7°（resolution：2') Vertical range（Y）±7º（resolution：2'）

Power：3.5kw,〜380v±38v, 50HZ±1HZ

Source of Air：0.4〜0.5MPa,250L/min(instantaneous flux when braking)

Sour of cooling water:0.2〜0.4mpa;5L/min

Touching Panel： 7.7inch

Dimension:645mm×925mm×2820mm

Weight:2500kg