ID wafer Slicer

Designed for automatically slicing semiconductor material, glass, ceramic, lithium tantalite and lithium columbate and other hard or fragile materials.

Main Features Spindle unit： It adopts vertical spindle design. It uses radial ball bearing to increase the rigidity, precision and life. Its vibration is small. Worktable unit Worktable use high precision linear guideway an AC servo system. The range of speed is wide and the low speed performance is better. It can satisfy requirements of different materials. Feeding unit Feeding system uses step motor and driving system to improve stability and precision.

MD-45S100D

Maxima Diameter of Cutting Ingot: ＜￠100mm

Blade Standard: φ422mm×φ152mm×0.15mm □Maximal Length of Cutting Ingot: 350mm

Cutting feeding speed: 1〜99mm/min

Cutting Return Speed:1〜999mm/min

Stepping deviation of feeding system: ±0.007mm(testing with l mm feeding step)

Range of Wafer Thickness: 0.001〜40.00mm

Adjustment of Crystal Direction: Horizontal range（x）±7°（resolution:2')Vertical range（Y）±7º （resolution：2'）

Power：2.5kw 〜380v±38v 50HZ±1HZ

Source of Air：0.4〜0.5MPa □Touching Panel：5.7inch

Dimension: 1100mm×660mm×2230mm □Weight：1100kg

Optional Solution：

￠422mDeep blade plate for Range of wafer thickness maximal 58.000mm

￠457mm blade plate for range of ingot diameter maxma1￠105mm